A quantitative study of the dynamic response of compliant microfluidic chips in a microfluidics context


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Hébert, M., Huissoon, J. et Ren, C. L. (2022). A quantitative study of the dynamic response of compliant microfluidic chips in a microfluidics context. Journal of Micromechanics and Microengineering, 32 (8). Article 085004. ISSN 0960-1317 DOI 10.1088/1361-6439/ac7844

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Polydimethylsiloxane (PDMS) is a widely used material for microfluidic devices due to its low cost, superior optical properties and fast iterative design process. Its softness however creates challenges for the device design and operation because part of the applied pressures contributes to deform chips instead of controlling the flow. The resulting dynamic behaviour is often ignored in passive microfluidic that focuses on the static behaviour of the chip, however, can cause low accuracy to active microfluidic that actuates flow frequently. Therefore, understanding the dynamic behaviour of microfluidic devices due to material compliance is of fundamental and practical importance. In this study, the microfluidic chip compliance is carefully considered by separating it from the sample tubing compliance. The capacitance is retrieved by assuming a symmetric RC circuit based on the experimentally determined time constant and chip resistance. The experimental capacitance is compared to a theoretical formula for chip designs with different height-to-width ratios and height-to-length ratios and for various fluids. The accuracy is within one order of magnitude that is much closer than previous approximations. © 2022 The Author(s). Published by IOP Publishing Ltd.

Type de document: Article
Mots-clés libres: Capacitance Dynamic response Microchannels Microfluidic chips Optical properties Polydimethylsiloxane Silicones Active control Chip deformations Design-process Device design Dynamic behaviors Iterative design Low-costs Microfluidic-chips Microfluidics devices Quantitative study Microfluidics chip deformation PDMS
Date de dépôt: 28 févr. 2023 19:51
Dernière modification: 28 févr. 2023 19:51
Version du document déposé: Version officielle de l'éditeur
URI: https://depot-e.uqtr.ca/id/eprint/10503

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